濕式切割代工 Disco 6"& 8"&12" & 封裝射出光學透鏡模擬代工

晶圓切割代工能力簡介

Wafer Dicing Foundry Capabilities Overview

切割代工服務 | Service Overview

奧特維科技，您值得信賴的切割代工工廠！我們擁有先進的切割能力，專注於為客戶提供優質的代工服務。本公司提供專業晶圓、陶瓷等電子材料切割代工服務，支援 6 吋、8 吋與 12 吋晶圓尺寸，導入高精度濕式切割製程，適用於量產與高附加價值光電與半導體產品。

We provide professional wafer dicing foundry services supporting 6-inch, 8-inch, and 12-inch wafers. High-precision wet dicing processes are applied to meet volume production and high-value optoelectronic and semiconductor applications.

切割代工服務總覽 | Service Overview

本公司提供專業晶圓切割（Dicing）代工服務，支援 6 吋、8 吋與 12 吋晶圓尺寸，導入高精度濕式切割製程，適用於量產與高附加價值光電與半導體產品。

We provide professional wafer dicing foundry services supporting 6-inch, 8-inch, and 12-inch wafers. High-precision wet dicing processes are applied to meet volume production and high-value optoelectronic and semiconductor applications.

切割設備配置 | Dicing Equipment

【設備圖片區塊｜請置入實際設備照片】
DISCO Automatic Dicing Saw
• 支援晶圓尺寸：6” / 8” / 12”
• 製程類型：濕式切割（Wet Dicing）
• 特性：高精度對位、高穩定度切割、量產適用

Image Placeholder: DISCO Automatic Dicing Saw
• Supported wafer sizes: 6” / 8” / 12”
• Process type: Wet dicing
• Features: High-precision alignment, stable cutting performance, mass production ready

切割製程能力 | Process Capabilities

• 濕式切割（Wet Dicing）— 降低溫升與切割應力
• 低崩邊、低微裂紋控制
• 高重複精度直線切割
• 適用高硬度、高脆性材料

• Wet dicing process to minimize thermal impact and stress
• Low chipping and micro-crack control
• High repeatability straight-line cutting
• Suitable for hard and brittle materials

可切割產品應用 | Applicable Products

• LED / Mini LED / Micro LED 晶圓
• 氮化鎵（GaN）元件
• VCSEL / 雷射二極體晶圓
• 光電元件、感測器、半導體 IC

• LED / Mini LED / Micro LED wafers
• Gallium Nitride (GaN) devices
• VCSEL / Laser diode wafers
• Optoelectronic devices, sensors, and semiconductor ICs

品質與製程控管 | Quality & Process Control

切割製程導入標準化參數管理與品質控管流程，並可配合客戶需求提供試切、量產導入與製程驗證，確保產品一致性與長期可靠度。

Standardized process parameter control and quality management are implemented throughout the dicing process. Pilot runs, mass production ramp-up, and process qualification services are available to ensure product consistency and long-term reliability.