IC 封裝服務

• SOP / SOIC /QFP / QFN

• CIS (CMOS Image Sensor Package)

• FOWLP (Fan-Out Wafer Level Package)

 

 

• Flip Chip BGA (Flip Chip BGA)

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• BGA(Ball Grid Array)

 

• SIP(System in Package)

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• 晶片堆疊(Die Stacking (eMMC/UFS)